We specialise in the Physical Design of Electronics/ Power Electronics Products for Harsh Environments.
aspects of an Electronics Packaging/Mechanical Design programme, from
writing the requirements specification, developing a design concept,
manufacture of prototypes through to delivery of a fully certified
product design can be undertaken.
Analytical Capability encompasses both Stress and Thermal Management.
is undertaken using a mix of applications, from simple spreadsheets to
assess the outline requirements, Spice models for system level analysis
through to detailed Computational Fluid Dynamics (CFD) models. It
is not a case of simply analysing the design but assessing the
requirements and providing guidance on what the Thermal archittecture
of the product needs to be to meet those requirements.
is undertaken using Classical analysis through to Finite Element
Analysis (FEA) techniques, depending upon the complexity of the problem.
Physical design work is undertaken using Solidworks.
The primary CFD tool is Phoenics, although Flotherrm and ICEPAK have been used in the past
Manufacture & Certification
In addition to the basic design and analysis the following can also be supported:
High volume Supply Chain Management
New Product introduction and Certification
Launch of a first Generation micro-inverter
Project Management, New Product Introduction, Certification
MSc Project - Wave/Tidal Power Instalaltion Challenges
Development of Pure Electric vehicle drive components:
50kW Bi-directional Inverters, DC-DC Converters, Chargers,
Management of bespoke gearbox design programmes
Demonstrator vehicle system integration
Hybrid Vehicle Power Electronics - BSG, ISG
Electronic Control Units - Mini Body Controller, Bugatti Veyron Transmission controller
Outside Plant - Ionica Base Station Power Electronics
3G UMTS Power Amplifier
Central office equipment
Naval Antenna Systems
Avionics technology demonstrators
Demonstrator Antenna systems